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 STPS15H100C
High voltage power Schottky rectifier
Main product characteristics
IF(AV) VRRM Tj (max) VF(max) 2 x 7.5 A 100 V 175 C 0.67 V
K
A1 K A2
K
Features and Benefits

Negligible switching losses Low leakage current Good trade off between leakage current and forward voltage drop Low thermal resistance Avalanche capability specified STPS15H100CB DPAK STPS15H100CH IPAK
A1 A2
K A1
A2
Description
Dual center tab Schottky rectifier suited for switched mode power supply and high frequency DC to DC converters. Packaged in DPAK and IPAK, this device is intended for use in high frequency inverters. Table 1.
Symbol VRRM IF(RMS) IF(AV) IFSM IRRM PARM Tstg Tj dV/dt
1.
dPtot --------------dTj
Absolute Ratings (limiting values, per diode)
Parameter Repetitive peak reverse voltage RMS forward current Average forward current Surge non repetitive forward current Peak repetitive reverse current Repetitive peak avalanche power Storage temperature range Maximum operating junction temperature Critical rate of rise of reverse voltage
(1)
Value 100 10 Tc = 135 C = 0.5 Per diode Per device 7.5 15 75 1 6600 -65 to + 175 175 10000
Unit V A A A A W C C V/s
tp = 10 ms sinusoidal tp = 2 s square F= 1 kHz tp = 1 s Tj = 25 C
1 < -------------------------- condition to avoid thermal runaway for a diode on its own heatsink Rth ( j - a )
June 2006
Rev 4
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Characteristics
STPS15H100C
1
Characteristics
Table 2.
Symbol Rth(j-c) Rth(c) Junction to case Total Coupling 2.4 0.7 C/W
Thermal resistance
Parameter Per diode Value 4 Unit
When the diodes 1 and 2 are used simultaneously : Tj(diode 1) = P(diode1) x Rth(j-c)(Per diode) + P(diode 2) x Rth(c) Table 3.
Symbol IR(1)
Static electrical characteristics (per diode)
Parameter Reverse leakage current Test Conditions Tj = 25 C Tj = 125 C Tj = 25 C Tj = 125 C VR = VRRM IF = 7.5 A IF = 7.5 A IF = 12 A IF = 12 A IF = 15 A IF = 15 A 0.71 0.68 0.62 Min. Typ. Max. 3 1.3 4 0.8 0.67 0.85 V 0.73 0.89 0.76 Unit A mA
VF(1.)
Forward voltage drop
Tj = 25 C Tj = 125 C Tj = 25 C Tj = 125 C
1. Pulse test: tp = 380 s, < 2%
To evaluate the conduction losses use the following equation: P = 0.58 x IF(AV) + 0.012 IF2(RMS)
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STPS15H100C
Characteristics
Figure 1.
PF(av)(W)
7 6 5
Conduction losses versus average Figure 2. current
IF(av)(A)
9
= 0.5
Average forward current versus ambient temperature ( = 0.5)
8 7
Rth(j-a)=Rth(j-c)
= 0.2 = 0.1 =1
6 5 4 3
Rth(j-a)=70C/W
4 3 2
= 0.05
T
2 1
T
1
IF(av)(A)
0 0 1 2 3 4 5 6
=tp/T
7 8
tp
0
=tp/T
0 25
tp
Tamb(C)
50 75 100 125 150 175
9
Figure 3.
Normalized avalanche power derating versus pulse duration
Figure 4.
Normalized avalanche power derating versus junction temperature
PARM(tp) PARM(1s)
1
1.2 1
PARM(tp) PARM(25C)
0.1
0.8 0.6
0.01
0.4 0.2
0.001
0.01 0.1 1
tp(s)
10 100 1000
Tj(C)
0 0 25 50 75 100 125 150
Figure 5.
Non repetitive surge peak forward current versus overload duration (maximum values)
Figure 6.
Relative variation of thermal impedance junction to case versus pulse duration
IM(A)
100 90 80 70 60 50 40 30 20 10 0 1.E-03
IM t
Tc=125C Tc=25C
Zth(j-c)/Rth(j-c)
1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2
=0.5
= 0.2 = 0.1 = 0.5
Tc=75C
T
Single pulse
t(s)
1.E-02 1.E-01 1.E+00
0.1
tp(s)
1.E-02 1.E-01
0.0 1.E-03
=tp/T
tp
1.E+00
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Characteristics
STPS15H100C
Figure 7.
Reverse leakage current versus reverse voltage applied (typical values)
Tj=150C
Figure 8.
Junction capacitance versus reverse voltage applied (typical values)
F=1MHz Vosc=30mV Tj=25C
IR(mA)
1.E+01
1.0
C(nF)
1.E+00
Tj=125C
1.E-01
Tj=100C
Tj=75C
0.1
1.E-02
Tj=50C
1.E-03
Tj=25C
VR(V)
1.E-04 0 10 20 30 40 50 60 70 80 90 100
0.0 1
VR(V)
10 100
Figure 9.
Forward voltage drop versus forward current
Figure 10. Thermal resistance junction to ambient versus copper surface under tab (epoxy printed board FR4, Cu: 35m)
Rth(j-a)(C/W)
100 90
IFM(A)
100
Tj=125C (Maximum values)
80 70
10
Tj=125C (Typical values) Tj=25C (Maximum values)
60 50 40 30 20
VFM(V)
1 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
10 0 0 2 4 6 8
S(cm)
10 12 14 16 18 20
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STPS15H100C
Package Information
2
Package Information
Epoxy meets UL94,V0 Table 4. DPAK Package mechanical data
Dimensions Ref Millimeters Min. A A1 A2 B B2 C C2 D E G H L2 L4 V2 2.20 0.90 0.03 0.64 5.20 0.45 0.48 6.00 6.40 4.40 9.35 Max. 2.40 1.10 0.23 0.90 5.40 0.60 0.60 6.20 6.60 4.60 10.10 Inches Min. 0.086 0.035 0.001 0.025 0.204 0.017 0.018 0.236 0.251 0.173 0.368 Max. 0.094 0.043 0.009 0.035 0.212 0.023 0.023 0.244 0.259 0.181 0.397
0.80 typ. 0.60 0 1.00 8
0.031 typ. 0.023 0 0.039 8
Figure 11. DPAK Footprint (dimensions in mm)
6.7
6.7
3 3 1.6 2.3 2.3 1.6
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Package Information Table 5. IPAK Package mechanical data
STPS15H100C
Dimensions Ref. Millimeters Min. A A1 A3
A E B2 L2 C2
Inches Min. 0.086 0.035 0.027 0.025 0.204 Typ. Max. 0.094 0.043 0.051 0.035 0.212 0.037 0.035
Typ.
Max. 2.40 1.10 1.30 0.90 5.40 0.95
2.20 0.90 0.70 0.64 5.20
B B2 B3 B5
D
0.30 0.45 0.48 6 6.40 2.28 4.40 16.10 9 0.8 0.80 10 9.40 1.20 1 0.354 0.031 4.60 0.173 0.60 0.60 6.20 6.60 0.017 0.019 0.236 0.252
C C2
0.023 0.023 0.244 0.260 0.090 0.181 0.634 0.370 0.047 0.031 0.039 10
H L
L1
B3 B V1 A1
D E e
e G
B5
C A3
G H L L1 L2 V1
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STPS15H100C
Ordering Information
3
Ordering Information
Ordering type STPS15H100CB STPS15H100CB-TR STPS15H100CH Marking S15H100 S15H100 S15H100CH Package DPAK DPAK IPAK Weight 0.30 g 0.30 g 0.35 g Base qty 75 2500 75 Delivery mode Tube Tape andreel Tube
4
Revision History
Date Mar-2004 08-Jun-2006 Revision 3 4 Last issue Reformatted to current standard. Added IPAK. Changes
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STPS15H100C
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